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[Application Example] BGA Void Analysis Technology "BGA Pro"

Clearly display the state inside the solder and assist with soldering analysis!

We would like to introduce a product that applies "Smart X-ray." "BGA Pro" assists in soldering analysis by calculating and processing image signal changes of BGA and CSP that are not visible in regular X-ray transmission images, quantifying their size and position, and clearly displaying the internal condition of the solder. 【Applicable Uses】 ■ By quantifying the void state of BGA and CSP, it can evaluate the soldering condition. ■ Understanding the void state can be utilized as information for setting conditions such as reflow. *For more details, please refer to the PDF document or feel free to contact us.